Description:Fully Automatic Inspection And Sorting System Applicable Product:Devices are integrated circuit devices in die form contained on film Product Size:8”& 12” Tape:UV-Tape、Bule-tape Work Mode:Wafer to Wafer(Customized) FOV:17X17mm Detect Area:Front/Back、Left/Right、Backside Detect Capalitilty:≥10um UPH :18000/H Position Accuracy:±30um