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This post is an excerpt on graping from Indium Corporation’s The Printed Circuits Assemblers Guide to Solder Defects.

Introduction  

The growth of personal electronic devices continues to drive the need for ever-smaller active and passive electrical components. This miniaturization trend, together with the demands for RoHS-compliant Pb-free assembly, has created more challenges, including the graping effect.

Links to hotwires.net (2)

• circuitsassembly.com Circuits Assembly Online Magazine - Home
• pcdandf.com Printed Circuit Design & Fab Online Magazine - Home