Description: inviatech pcb layout technological design flex rigid pbc fabrication technological constrains signal integrity stack up design HDI pcb design micro electronic chip design miniature electronic design assembly process control soldering micro section pcb vendor qualification audit pcb incoming inspactions engineering process turn key process, PCB Layout Design and Quality PCB Layout Pre Fabrication Consultation / PCB fabrication knowledge / Engineering Process Assembly of Printed Circuit Boards and Flex Circu
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PCB Layout Design and Quality PCB Layout Pre Fabrication Consultation / PCB fabrication knowledge / Engineering Process Assembly of Printed Circuit Boards and Flex Circuits · Digital – High Speed · Flex & Flex Rigid · Analog & Power - High voltage PCB Design · RF Microwave / Mix Analog / Digital up to 40Ghz Readmore
Ultra High Density (Rigid / Flex / Flex Rigid) – HDI (High Density Interconnection) – Micro Via types / Buried Via / Via Filling / Buried Capacitors / Resistance / Via on PAD - Filling / PCB Cavity / Thermal Heat PCB dissipation. EMC - Design for low-noise, low-emission, and high-immunity (EN55022, EN55024, and NEBS (GR1089) requirements). Signal Integrity - reference-levels (power and ground bounce) / noise across PCB power distribution, Crosstalk, Reflections. MCM – IC’s Miniaturization Substrate / Ultra
Cadence Allegro Very Best (Mentor Expedition) PCAD OrCAD / OrCAD PCB Layout Readmore