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Description: Advanced packaging in 2.5/3D, custom solutions for specialized markets, low-to-mid volume BEoL, expertise in IC design and prototyping

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Semiconductor design, prototyping, and advanced packaging

If your product would benefit by 3D architecture, a smart interposer, chiplet integration, or other advanced packaging, let NHanced Semiconductors be your complete supply chain solution.  We provide turnkey assemblies and components including custom design, design consultation , TSV insertion, and access to the latest and best semiconductor technologies .  Take advantage of our deep experience in 3D and 2.5D enablement.  We do multi-die design, assembly, sourcing, packaging, final test – everything you need

Home Foundry 2.0 Services Design Services Fab Services Advanced Packaging Package Assembly Test Markets Government Specialty Markets Technologies 2.5D 3D About Our Team Locations Careers Contact News & Resources News/PR Blog Terminology NHanced Semiconductors The USA’s First Pure-Play Advanced Packaging Foundry FOUNDRY 2.0 SERVICES MARKETS TECHNOLOGIES NHanced Semiconductors The USA’s First Pure-Play Advanced Packaging Foundry. FOUNDRY 2.0 SERVICES MARKETS TECHNOLOGIES Foundry 2.0 is Here At NHanced Semicon

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