Description: Laserslag.com, you are assured to get laser slag removal, edge deburring equipment, machine substrate lasered and hole drilling services as per your need.
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This laser slag, on microelectronic substrates, needs to be removed because the loose material can cause metalization adhesion problems especially in Aluminum Nitride .
Laser slag can be and often is removed manually but it is inconsistent, and if properly done, costly. Lapping and polishing only, does not clean out slag from holes.
Our unique process allows laser slag to be removed or deslaged and sharp edges rounded on substrates and laser holes. By various techniques, more material can be removed from one side than from the other, and on substrate edges, it is possible to round one or more edges and leave other edges sharp. The degree of rounding is controllable.