Description: Polished Silicon wafers are available from Valley Design, and can be custom polished and diced to your specifications. Standard SEMI silicon wafers are also available.
We have been polishing Silicon wafers for over 40 years, and also provide Silicon dicing services. We can provide any size Silicon wafer in custom dimensions from as large as 450mm to chips as small as .127mm square. SEMI standard Silicon wafers are also available in diameters 2”, 3”, 100mm, 125mm, 150mm, 200mm, 300mm and 450mm. Standard Silicon wafers can be thinned and polished to any custom thickness as thin as 10 microns thick and are available in standard tolerances, or as tight a thickness tolerance
We have extensive experience with providing silicon polishing and dicing services to clients in a variety of industries, such as research, optoelectronic applications, and product development in sensor and laser applications. We also provide edge-angle polishing for optoelectronic applications, and bonded wafer thinning. We can also thin and polish individual silicon dies and SOI (Silicon Oxide) layers.
Valley Design can customize a Silicon wafer to any size or thickness that you require for your project. We offer optical grade silicon CZ (Czochralski) in as-cut wafers, lapped or polished, as well as single and double side polished. Various orientations, resistivity and dopings are available. Valley Design can deliver Silicon wafers that meet your needs, no matter how specific your requests. Our Silicon polishing and dicing services are renowned for accuracy in meeting exacting specifications. We underst
Precision Metal Optics - Valley Design